Korea-based OLEDON announced that it has developed a vertical-plane source deposition technology that can be used to produce both small-area and large-area OLED panels. The company is now adapting this technology for ultra-large substrates - up to 12-Gen (3300x4000 mm) in size.
OLEDON says that currently-used inline evaporation processes lower the yields for large-area production due to FMM sagging and difficult control of the multiple sources. The company's vertical plane source deposition may prove to be a viable alternative.
In 2017, OLEDON developed a plane-source evaporation shadow mask process that can achieve a shadow distance of 0.38um - which can enable OLED display resolution to reach 2,250 PPI. The company says its technology will be able to achieve 3,300 PPI in the future.
