BOE and Qualcomm announced plans to establish a strategic collaboration to develop innovative display products featuring Qualcomm's 3D Sonic ultrasonic fingerprint sensors. BOE have already started to embed Qualcomm's sensor in its flexible OLED displays.
BOE also says that this collaboration will result in a streamlined supply chain and reduces the bill of materials (BoM) and R&D expenses expenses. BOE says that it will start shipping the integrated panels and sensors in H2 2020.
Posted: Apr 16,2020 by Ron Mertens
