The U.S. Display Consortium (USDC) and National Starch and Chemical Co. (NSC, Bridgewater, N.J.) today announced that their joint R&D project on packaging technology for organic light-emitting diode (OLED) displays has yielded commercially viable sealants and packaging adhesives. NSC has commercialized several of these products under the Eccoseal(TM) brand name within its Emerson & Cuming division, and will continue to launch products derived from the program in 2006-2007. Begun in October 2002 under a grant from the U.S. Army Research Laboratory, the contract was completed last month, with a total R&D investment of $2.21 million, cost-shared between USDC and NSC.
The contract outlined a program for developing a radiation-curable perimeter sealant for both plastic and glass OLED packages.
