Linde Group and Shanghai University announced today that they will partner to develop new advanced packaging solutions for flexible displays (especially OLEDs) to enhance product quality and cost efficiencies. Linde has invested EUR 80,000 in the first phase of this project.
They aim to develop a new generation of thin-film encapsulation material and packaging solutions for the manufacturing of displays: single and composite structures of thin-film encapsulation materials and related gas application techniques.
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Posted: Mar 15,2010 by Ron Mertens
