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GE Global Research and TOKKI Corporation announced a joint agreement to develop PECVD Film Encapsulation technology and equipment for manufacturing organic electronics such as OLED displays.

The goal is to develop and demonstrate equipment that could serve as the foundation for the future manufacturing and sale of glass-based displays that are thinner in design and much lower in cost.

As part of the agreement, GE Global Research will license its patented PECVD film encapsulation process to TOKKI for use in the company's state-of-art OLED manufacturing equipment. OLED devices require a high degree of hermetic sealing or "encapsulation," since moisture and oxygen can impede the devices' functionality.

GE Global Research is presenting details on its successful development of a substrate system for flexible OLEDs at the Flexible Displays & Microelectronics Conference, Feb. 6-9 in Phoenix, Ariz. The system features a developmental high-temperature Lexan polycarbonate (PC) film from GE - Plastics combined with a transparent, ultra-high-barrier coating to help protect the OLED device against oxygen and moisture.

This research, jointly funded by the U.S. Display Consortium (USDC) and GE, is designed to address the critical need for plastic substrates that can enable cost-effective, lightweight, flexible organic displays. Min Yan, GE materials scientist, will give a presentation on the new substrate system, which is currently being produced in batch mode and will ultimately be moved to a roll-to-roll process for cost efficiency. In addition, GE - Plastics is featuring a variety of plastic films for electrical/electronic display applications during the exhibition.